PCB Reverse Engineering

PCB Layout design (SS, DS & ML up to 24 layers)

Single-sided, double-sided, and Multi-layer boards (up to 24 layers) with high density design handing capabilities.

Component Library creation as per IPC standard.

Design for Surface mount, through-hole & mixed technology with QFN, BGA, PGA & fine pitch components.

Design as per EMI/EMC requirement.

Design for manufacturability (DFM)

Design for Assembly (DFA)

Bill of material generation, Gerber generation, Stack up creation for multilayer.

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